A 3D Heterogeneous Integration Future: Enabling Continued System-level Electronic Scaling
(51:10 plus Q&A) Dr. Eric Beyne (IMEC)
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Tutorial: Reliability Physics and Failure Mechanisms in Electronics Packaging
Nov, 2022 (2:13:13 in 5 modules) -- stress conditions, thermo-mechanical, vibrational, moisture, humidity, electromigration, acceleration factors, applications ...
Submicron Nanosecond Thermoreflectance Imaging for Thermal and Failure Analysis
Jan 2023 (22:30 plus Q&A) -- thermal imaging, fine-geometry, static/dynamic, high-resolution, thermoreflectance, near-ultraviolet to infrared, examples ...
3D Heterogeneous Integration; Hardware Technologies for Computing; NSF Funding
(3 videos) July 2022 -- talks from SEMICON/West 2022