Using Diamond in Advanced Packaging: Current Developments and Status
March 14 @ 7:50 am - 9:00 am
Joana Mendes will present a detailed background on current status of diamond film development. Artificial diamond films are deposited from a mixture of methane and hydrogen — and the deposition of the material is not an expensive process. However, the integration of diamond films and electronic devices requires the development and optimization of new processing lines, which is a costly procedure. LEDs, for instance, have become low-cost components. Are manufacturers willing to trade the current low cost for higher efficiency/performance and longer lifetime? Specific upcoming possibilities are for HEMT packaging, 5G/6G RF modules in cell phones, and in heterogeneous integration such as for high-power SiP modules.
Jeroen van Duren will describe his Foundry’s method of growing diamond boules and producing 4″ diamond wafers. He will profile the wafer-growing method and current status of using single-crystal diamond for 2.5D and 3D packaging in high-thermal-load
applications such as laser heat-spreaders, data-center processors, and other high-heat-flux situations. Costs might soon be competitive with current more-elaborate cooling methods and allow advances in packaging density.
Speaker(s): Joana Catarina, Jeroen