Seventh Annual Symposium on Heterogeneous Integration Roadmap and Annual Meeting

Future Vision for Heterogeneous Integration from Global Perspectives, 2 days, 8 keynote talks, working groups …
Agenda:
LOCATION may shift to Samsung Auditorium in San Jose TBC
pre-Symposium Tutorial re Chiplets
Wednesday Feb 21- Day afternoon starting at 1 pm
Four presentations each 35 minutes
Thursday Feb 22- Day 2 Morning
– Four (4) keynote talks in the morning – 9am to 12 noon. (Pacific Time)
– Two Groups of TWGs Panel Session – Panel Presentation + exchange & collaboration
Moderator : Ravi Mahajan
09:00 am – 09:10 am HIR Welcome
09:10 am – 09:30 am HIR Future Vision
09:30 am – 10:05 am
10:05 am – 10:40 am
10:50 am – 11:25 am
11:25 am – 12:00 am
Box Lunch
Thursday 22- Day 2 Afternoon
01:00 pm – 02:00 pm Group 1 Cross TWG Panel Presentation (10 min per TWG)
02:00 pm – 02:30 pm Group 1 Cross TWG, dialogue & Q&A
Break
02:40 pm – 03:30 pm Group 2 Cross TWG Panel Presentation (10 min per TWG)
03:30 pm – 04:00 pm Group 2 Cross TWG Dialogue & Q&A
04:00 pm – 04:30 pm Presentation
04: 30pm – 05:00 pm Town Hall; Open Dialogue
Group 1
– Automotive: Vikas Gupta (ASE), Veer Dhandapani, (NXP)
– SiP & Module: Erik Jung & Rolf Aschenbrenner (Fraunhofer IZM), Klaus Pressel (Infineon)
– MEMS & Sensors Integration: Mary-Ann Maher (Soft MEMS) Shafi Saiyed (ADI),
– Single & Multi Chip Integration: Lei Shan (Ampere), William Chen (ASE), Annette Teng (Promex)
– Integrated Power Electronics: Patrick McCluskey (U-Md), Douglas Hopkins (NCSU)
– Supply Chain: Kitty Pearsel, Melissa Grupen Shemansky & Paul Trio (SEMI), Siva Sivasankar (Google)
Group 2
– Medical, Health & Wearables: Mark Poliks (Binghamton University), Nancy Stoffel (GE), Jan Vardaman (TechSearch)
– IoT: Robert Lo (ITRI Taiwan) Rockwell Hsu (Cisco)
– Mobile: SB Park (Binghamton University ) Benson Chan (Binghamton University), William Chen (ASE)
– Reliability Abhijit Dasgupta, Richard Rao (Marvel) & Shubha Sahasrabudhe (Intel)
– Emerging Research Devices: Meyya Meyyapan, Bill Bottoms (3MTS)
Friday Feb 23- Day 3
– MORNING: Four (4) keynote talks in the morning – 9am to noon.
– AFTERNOON: 23 TWGs in four groups. Panel Session with theme of exchange & collaboration
Friday Feb 23- Day 3 Afternoon
01:00 pm – 02:00 pm Group 3 Cross TWG Panel Presentation (10 min per TWG)
02:00pm – 02:30 pm Group 3 Cross TWG dialogue & Q&A
Break
02:40 pm – 03:40pm Group 4 Cross TWG Panel Presentation (10 min per TWG)
03:40 pm – 04:10 pm Group 4 Cross TWG Dialogue & Q&A
04:10 pm – 04:30 pm Presentation
04: 30pm – 04:50 pm Town Hall : 2023 plan
04:50pm – 05:00 pm Conference end
Group 3
– High Performance Computing & Data Centers: Kanad Ghose (Binghamton University)
– 2D-3D Interconnect: Ravi Mahajan (Intel), Subramanian Iyer (UCLA),
– Thermal Management: Yin Hang (Meta), Madhu Iyenger (Google), Azmat Malik (Acuventures), Weihua Tang (Intel)
– Integrated Photonics: Bill Bottoms (3MTS), Amr Helmy (University of Toronto),
– Test: Jeorge Hurtarte (Lam Research), Ken Butler (Advantest)
– Co-Design: Jose E. Schutt-Aine (University of Illinois)
Group 4
– 5G Communications & Beyond: Tim Lee (Boeing), Herbert Bennett (Alta Tech)
– Simulation: Chris Bailey (Arizona State U), Xuejun Fan (Lamar University)
– Aerospace & Defense: Tim Lee (Boeing), Dan Blass (Lockheed-Martin)
– WLP (Fan-in & Fan Out): Erik Jung (Fraunhofer IZM), Rozalia Beica (AT&S),
– Materials & Emerging Research Materials: Bill Bottoms (3MTS)
– Cyber Security: Sohrab Aftabjahani (Intel)
SEMI World Hdqtrs, 673 S Milpitas Blvd, Milpitas, California, United States, 95035