Recent Advances on Cu-Cu and Hybrid Bonding for Advanced Packaging Platforms and Applications

[]Bonding technology is the key to the success of vertical stacking in 3D integration, heterogeneous integration, and advanced packaging applications. Furthermore, developing a bonding technology which can be performed at low temperature becomes significant to avoid the concerns of low thermal budget, low mechanical stress, and high reliability in many applications. Among various bonding technologies, bumpless Cu-based hybrid bonding has become the main solution to the requirement of high speed and density since Cu has its excellent electrical performances, thermal properties, and readiness in the backend and packaging fabrication, as well as cost consideration.
This talk will describe the history and advances of current Cu-Cu bonding, including technology development and solutions of low temperature Cu-Cu bonding. A wetting/passivation technique for room temperature Cu bonding and its mechanism will be presented. Next, hybrid bonding, an enabling technology for fine pitch/size bonding in multiple 3D integration and advanced packaging applications, will be mentioned with its history development. Current Status, challenges and their solutions, such as fine pitch, warpage, and mechanical and thermal stress, to reach hybrid bonding will be discussed. Finally, applications and recently developed platforms based on hybrid bonding with be introduced.
Speaker(s): Kuan-Neng Chen,
Virtual: https://events.vtools.ieee.org/m/423122