Qualification, Capability and Supply Chain Development of Advanced PCBs

The European space standards on PCB design, qualification and procurement include design margin to mitigate risks of latent short-circuit and open-circuit failures, as well as novel test and inspection methods for qualification and for lot conformance, such as temperature humidity bias test, conductive anodic filament test, interconnect stress test and dark-field microscopy. To investigate the reliability of the advanced manufacturing methods, various traditional and accelerated thermal stress tests are performed on two and three layers of staggered and stacked microvia configurations, as well as the thermo-mechanical modelling of stress factors. A European IPC working group on microvia reliability is using four available accelerated coupons test methods for a robust screening of three stacked microvias, which intends to secure a European high-reliability supply chain. The presentation will provide an overview of ESA’s efforts to reinforce the European PCB supply chain, to develop high density interconnect technology and to qualify PCBs for high reliability applications.
Speaker(s): Stan Heltzel
Virtual: https://events.vtools.ieee.org/m/379700