Photonic Wire Bond Packaging for Silicon Photonic Optical Fibres and Laser Integration

Photonic integrated circuit technology (silicon photonics) is used for many applications including optical data communications, optical and quantum computing, and sensing including LiDAR, biomedical and environmental. A major packaging challenge facing the industry is optical coupling between multiple integrated photonic components together with low insertion loss, in a cost effective manner, into a package suitable for commercialization. A promising approach is to create “photonic wire bonds” (PWBs), namely optical waveguides that look similar to conventional electrical wire bonds. PWBs are a high-yield, low-insertion-loss, and high-throughput versatile method of packaging photonic components such as chip-to-fiber and laser-to-chip interconnects. Utilizing two-photon polymerization to fabricate freeform 3D polymer structures, PWBs can connect components with arbitrarily disparate mode field shapes and sizes. Capabilities and advantages of the PWB technique include: gain chip integration with existing ’known good die’, dense optical I/O connections to the chip, scalability from prototyping to high-volume, and interconnects that are not possible with other standard photonic packaging techniques.
Speaker(s): Lukas Chrostowski,
Virtual: https://events.vtools.ieee.org/m/372682