IEEE Build-Up Substrate Symposium (BUSS)

BUSS’24 is a two-day, in-person event — May 2-3, 2024 at SEMI Hdqtrs, Silicon Valley, CA USA
We are living in the era of heterogenous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogenous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China.
However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. As the US Congress debates H.R. 3249, the Protecting Circuit Boards and Substrates (PCBS) Act, this Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.
SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, 95035