High-resolution X-ray Computed Tomography (XCT) for Fault Isolation in Advanced Packaging

Advanced packaging of microelectronic products, especially 3D integration and hybrid bonding, provide challenges to process control and physical failure analysis as well as for the understanding of failure mechanisms. In this talk, the inherent advantages of non-destructive X-ray computed tomography (XCT) in the sub-micron and nano range are demonstrated for fault isolation and for the understanding of the evolution of reliability-limiting defects in packaged microchips. Sub-micron and nano-XCT enable the representation of structures and defects (e.g. micropores and microcracks) in advanced packaging and interconnect structures. Another unique advantage of XCT — as opposed to destructive FA methods — is that kinetic processes such as crack propagation, which can lead to degradation and ultimately failure of microelectronic components, can be imaged with high resolution.
Speaker(s): Ehrenfried Zschech,
Virtual: https://events.vtools.ieee.org/m/363155