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Second Annual IEEE Build-Up Substrate Symposium (BUSS)

May 8 @ 8:00 am - May 9 @ 5:00 pm

[]We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China.
However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. This Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.
Agenda:
Sessions:
— Substrate Manufacturing and Onshoring
— Materials for Substrates
— Emerging Substrate Technologies
— Panel Equipment and Technologies for Substrates
— Inspection and Testing
… plus two panels:
— Substrate End Users
— Onshoring and Startups
SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, 95035

Details

Start:
May 8 @ 8:00 am
End:
May 9 @ 5:00 pm
Website:
https://events.vtools.ieee.org/m/463028

Venue

SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, 95035