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Eighth Annual Symposium on Heterogeneous Integration Roadmap and Annual Meeting

February 19 @ 8:00 am - February 21 @ 5:00 pm

Future Vision for Heterogeneous Integration from Global Perspectives, 3 days, keynote talks, working groups …
Registration is $140 ($115 for IEEE members). PayPal is the credit card payments processor; please do not use your Paypal account during the payment process here.
When you get to the Visitor Parking area, staff will guide you to available section, and to the South Tower to check in and get your badge.
Speaker(s): , , ,
Agenda:
Check (https://eps.ieee.org/technology/heterogeneous-integration-roadmap/annual-hir-conference.html) FOR LATEST UPDATES and speaker bios.
Day 1 – Wednesday February 19, 2025
Forum on AI & Energy Efficiency and Advanced Packaging Metrology
9:00 am – 10:30 am Data Center AI & Energy Efficiency Forum Srilatha Manne (AMD), Arman Shehabi(LBL), Moderator: John Shalf
10:30 am – 10:40 am coffee & tea break
10:40 am – 12:10 pm Adv Packaging Metrology: NIST Metrology Team Paul Hale & Antara Nandi, Moderator: Bill Chen
12:10 pm – 1:10 pm Lunch
1:10 pm – 1:30 pm Welcome & Agenda Review
1:30 pm – 2:15 pm Ramune Nagisetty (NATCAST )
2:15 pm – 2:50 pm George Orji (NIST) Keynote
2:50 pm – 3:25 pm Henning Braunisch (SMART USA)
3:25 pm – 4:00 pm Christopher Bailey – ASU Initiatives 4:00 pm – 4:35 pm Raj Jammy (IMEC USA)
4:35 pm – 5:30 pm Wine Tasting Reception
Day 2 – Thursday February 20, 2025
9:00 am – 9:05 am Welcome
9:05 am – 9:30 am HIR Vision
9:30 am – 10:05 am Dae-Woo Kim (Samsung Electronics, South Korea)
10:05 am – 10:40 am Madhavan Swaminathan (PSU) 10:40 am – 10:50 am Coffee & Tea Break
10:50 am – 11:25 am Albert Heuberger (Fraunhofer Microelectronics Group)
11:25 am – 12:00 pm Jimmy Lu (ITRI ERSO Taiwan)
12:00 pm – 1:00 pm Lunch
1:00 pm – 1:10 pm Contribution Recognition – Plaque Presentation
1:10 pm – 3:00 pm TWG Collaboration Meeting Team 1
3:00 pm – 3:05 pm Coffee & Tea Break
3:05 pm – 5:00 pm TWG Collaboration Meeting Team 2
5:00 pm – 6:00 pm Wine Tasting Reception
Day 3 – Friday February 21, 2025
9:00 am – 9:10 am Welcome and Agenda Review, Hualiang Shi, EPS SCV Chapter Chair
9:10 am – 9:45 am Prith Banerjee (ANSYS)
9:45 am – 10:20 am TBD
10:20 am – 10:30 am Coffee Break
10:30 am – 11:05 am Srinivas Vempati (Institute of Microelectronics -IME, Singapore)
11:05 am – 11:40 am Subramanian Iyer (UCLA) – "AePeX America – Implementing Strategic Directions for the US Electronics Packaging Industry"
11:40 am – 12:40 am Lunch
12:40 pm – 2:30 pm TWG Collaboration Meeting Team 3
2:30 pm – 2:40 pm Coffee & Tea Break
2:40 pm – 4:30 pm TWG Collaboration Meeting Team4
4:30 pm – 4:45 pm Conference Wrap up
Samsung Electronics Campus, 3655 N First Street, San Jose, California, United States, 95134

Details

Start:
February 19 @ 8:00 am
End:
February 21 @ 5:00 pm
Website:
https://events.vtools.ieee.org/m/461185

Venue

Samsung Electronics Campus, 3655 N First Street, San Jose, California, United States, 95134