A 3D Heterogeneous Integration Future: Enabling Continued System-level Electronic Scaling
(51:10 plus Q&A) Dr. Eric Beyne (IMEC)
Tutorial: Reliability Physics and Failure Mechanisms in Electronics Packaging
(2:13:13 in 5 modules) — stress conditions, thermo-mechanical, vibrational, moisture, humidity, electromigration, acceleration factors, applications …